Panel Carrier Bond

Power

AC220V 3φ 60HZ 165A 63KVA

AC220V 3φ 60HZ 165A 63KVA

Dimension

(mm)

L5000 x W4000 x H2800

L5000 x W4000 x H2800

Dimension of device

Length × Width: 310 mm × 310 mm ±0.1 mm
Thickness: 1,000–3,000 μm

LxW：310mm x 310mm ±0.1mm

Thickness：1000μm~3000μm

Dimension of carrier

Length × Width: 310 mm ±0.1 mm
Thickness: 1,000–3,000 μm

LxW：310mm x 310mm ±0.1mm

Thickness：1000μm~3000μm

Bonder Module

Vacuum Level: 76 mTorr within 2 minutes
Maximum Temperature: 250°C
Temperature Uniformity: ±2% at 180°C
Pressure Uniformity: <10% at 0.3 MPa
Post-Bonding Accuracy: X/Y ≤0.2 mm

Vacuum：76mTorr at 2min

Temp. ：Max. 250°C

Temp. Uniformity：180°C±2%

Pressure Uniformity：<10%@0.3MPa

Bonding Accuracy：X、Y Accuracy≦0.2mm

Oven Module

Vacuum Level: 76 mTorr within 1 minute
Maximum Temperature: 250°C
Temperature Uniformity: ±2% at 100°C and 200°C
Heating Method: Hot Plate
Cleanliness Class: Class 100

Vacuum：76mTorr at 1min

Temp. ：Max. 250°C

Temp. Uniformity：100°C and 200°C±2%

Heating Method：Plate Heater

Cleanroom Classification：Class 100

Cooling Module

Cooling Method: Air Cooling
Number of Layers: 4

Cooling method：Air Cooling

Later Count：4

Remark

Cleanliness Class: Class 100
SECS/GEM
SEMI S2 Report

Cleanroom Classification：Class 100

SECS/GEN

SEMI S2 report