Cabinet UV Oven
Substrate size:G3.5~G10.5 Real time monitor of UV light density with real time power output control function Adopt electronic ballast that can control power output precisely Precise temperature control system UV lamp abnormal monitor
Seal Main Cure/Annealing Oven /CF Post Bake
Substrate size:G3.5~G10.5 Temperature range:120℃~350℃ Excellent temperature uniformity:≦±3℃ O2 control:3%~30%, ±1% Cleanliness level:Class 10/100/1,000 Transportation:Robot Recipe edit
PI Post Bake/PA Oven/BPC Oven/ARC Oven
Substrate size:G3.5~G10.5 Temperature range:120℃~450℃ Excellent temperature uniformity:≦±3℃ O2 control:3%~30%, ±1% Cleanliness level:Class 10 Transportation:Robot Recipe edit
IGZO Annealing Oven
MAX. temperature:450℃ Temperature uniformity:±3℃ O2 control:3%~30%, ±1% Humidity control:Absolute humidity 5%~30%, ±1% Cleanliness level:Class 10 Multi-step temperature control Recipe edit
PI Oven for Flexible Display
Substrate size:G2~G6 MAX. temperature:600℃ Temperature uniformity:±4℃ Ramp-up/ramp-down speed:≧8℃/min. O2 control:≦100ppm Auto solvent burn off function
IR/LBCO
Body dimensions:W1400 x D20700 x H1700 (mm) / 8600 KG Winding machine:W1500 x D2250 x H1800 (mm) / 1200 KG Roll Receiver:W1500 x D2250 x H1800 (mm) / 1200 KG Glass substrate:Diameter MAX. Φ500 (mm), diameter φ3 “, φ6” universal, width MAX. Φ550 (mm), thickness 60μm ~ 300μm Electricity:AC380V、3φ、50HZ、147KVA Air pressure:> 6 kgf / cm²
Drying Equipment
Conveyor speed : 2 ~ 10 m / min. Conveyor width : 280 mm Effective width : 220 mm Pass line height : 770 + 50 mm Dimensions : L / W / H (cm) 120 / 51 / 119
Drying Equipment
UV lamp intensity : 60/80 W/cm. Conveyor speed : 4 ~ 20 m / min. Conveyor width : 400 mm Effective width : 350 mm Pass line height : 770 + 50 mm Dimensions : L / W / H (cm) 176 / 75 / 135
UV Cleaner
1.Dominant wavelength DUV:185nm and 254nm EUV:172nm 2.Transportation:Robot or conveyor 3.Effect of cleaning:Contact angle≦5∘ 4.Uniformity of irradiation:≧90% 5.Cleanliness leve:Class 10
RTR Annealing Oven/Laminator
1.Substrate width:220mm~600mm 2.Substrate thickness:50µm~200µm (without PF) 3.Conveyor speed:0.5 ~ 5M/min. 4.Rewinding accuracy:≦±0.5 mm 5.Cutting accuracy:≦±0.5 mm 6.Laminating accuracy:≦±1mm 7.No material alarm