PI Oven for Flexible Display
- Substrate size：G2~G6
- MAX. temperature：600℃
- Temperature uniformity：±4℃
- Ramp-up/ramp-down speed：≧8℃/min.
- O2 control：≦100ppm
- Auto solvent burn off function
- Quick ramp-up with IR heater
- Excellent temperature uniformity
- N2 recovery system
- Solvent treatment system
- Integrate with optional VOTGS (Volatile Organic Gases Treatment System) can reduce process contaminant and ambient smelling
- Fully automated capable
- Real time monitor of substrate temperature
Downloads
| Files |
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| Download Catalog |
