LAMINATOR SERIES EQUIPMENT
Lamination process: Conveyor speed:1~5m/min(adjustable) Pressure:2~4kg/cm² Dimension: External dimensions:L1280*W6540*H2263(mm)
Cabinet UV Oven
Substrate size:G3.5~G10.5 Real time monitor of UV light density with real time power output control function Adopt electronic ballast that can control power output precisely Precise temperature control system UV lamp abnormal monitor
Seal Main Cure/Annealing Oven /CF Post Bake
Substrate size:G3.5~G10.5 Temperature range:120℃~350℃ Excellent temperature uniformity:≦±3℃ O2 control:3%~30%, ±1% Cleanliness level:Class 10/100/1,000 Transportation:Robot Recipe edit
PI Post Bake/PA Oven/BPC Oven/ARC Oven
Substrate size:G3.5~G10.5 Temperature range:120℃~450℃ Excellent temperature uniformity:≦±3℃ O2 control:3%~30%, ±1% Cleanliness level:Class 10 Transportation:Robot Recipe edit
IGZO Annealing Oven
MAX. temperature:450℃ Temperature uniformity:±3℃ O2 control:3%~30%, ±1% Humidity control:Absolute humidity 5%~30%, ±1% Cleanliness level:Class 10 Multi-step temperature control Recipe edit
PI Oven for Flexible Display
Substrate size:G2~G6 MAX. temperature:600℃ Temperature uniformity:±4℃ Ramp-up/ramp-down speed:≧8℃/min. O2 control:≦100ppm Auto solvent burn off function
IR/LBCO
Body dimensions:W1400 x D20700 x H1700 (mm) / 8600 KG Winding machine:W1500 x D2250 x H1800 (mm) / 1200 KG Roll Receiver:W1500 x D2250 x H1800 (mm) / 1200 KG Glass substrate:Diameter MAX. Φ500 (mm), diameter φ3 “, φ6” universal, width MAX. Φ550 (mm), thickness 60μm ~ 300μm Electricity:AC380V、3φ、50HZ、147KVA Air pressure:> 6 kgf / cm²