Hybrid Bonding Process
1.The Best Solution for Permanent Bonding to Improve Yield.
2.Flexible process capability: WoW mode / Pre-anneal mode.
3.Superior pressure & temperature uniformity.
4.Max. pressure: 0.5MPa.
5.Max. temperature: 180℃.
6.Real time process status monitor.
7.SECS/GEM compatible.
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