Remote Plasma Treatment System

Julia Hsu

Patented rotary stage can enhance cleaning uniformity.
Patented ICP mode and chamber design can prevent static charge accumulation effectively.
No physical bombardment to damage substrate and chip. No change on surface structure and electrical property.
Equipped with removable and adjustable cassette to adapt to various sizes of magazines, trays and wafers.
High density plasma with high efficiency vacuum system design to gain higher throughput.
No electrode in the chamber. No secondary contamination.

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