Carrier Bonder
Carrier Bonder
SKU：WVL-A12
- Designed for Temporary Bonding process
- Superior pressure uniformity
- Max. pressure : 0.5 MPa
- Max. temperature : 250℃
- Flexible process capability : Vacuum Baking / Carrier Bonding
- Real time process status display
- SECS/GEM compatible
Downloads
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| Download Catalog |
