De-Warpage OVEN
TECHNICAL DATA
| Warpage Tolerance | 3mm |
| Temperature Uniformity | ±5°C |
| Pressure Range | 50N |
| Applicable product size | Max 12″ |
| Chamber Configuration | Dual Zone Independent Control |
| Heating Type | Electric + Hot Air Circulation |
| Cooling System | Water Cooling Assisted |
DUAL TECHNOLOGY PLATFORM
1. Motor Precision Press
- Two-stage pressing mechanism
- Stable linear pressure control
- High repeatability
2. Air Pressure Type
- Multi-layer pressing structure
- Independent upper/lower chamber control
- Real-time pressure monitor
APPLICATIONS
- CoWoS / FOWLP
- Panela Level Packaging
- AI / HPC Devices
WHY WARPAGE MATTERS
- Bonding failure
- Die shift
- RDL misalignment
- Yield loss in advanced packaging
FEATURE HIGHLIGHTS
- Optimized thermal circulation
- Uniform temperature distribution
- Controlled cooling system
- warpage tolerance ≤5mm
