Auto Mylar Peeler

PCB size	Length：300 ~ 726.4 mm (11″~28″) Width：300 ~ 610 mm (11″~24″)(in side) Thickness：1.5 ~ 7.0 mm (Include copper)
Dimension/Weight	External dimension：L 2226 x W1435 x H 2413 mm/2500 kg Pass line height ： 950+50mm
In-feed Section	The film needs to be torn separately with the central plate feed of the automatic plate release machine.
Peeling Section	Peeling method : embossing roller + air blow.
	Mylar collection method : Mylar welded + air shaft collector.
	Blower：0.85KW , 220V 3φ*2pcs
Out-feed Section	NG Buffer：4pcs Roller material : HCPP Structure : Can be moved backward
Utilities	Clean dry air : 6Kg/cm2 Air consumption : 200L/min Air exhaust : 8CMM*1, φ4″
Laminated Accuracy	Bare leading edge :2 ~ 5 mm，Edge chamfers and corner radii not included
Active Area of Film Damage Cutter Wheel	8mm (roller width)

High speed and stable production for many years with a production rate of ≥6 pieces/minute.
Suitable for both inner and outer layers and has a wide range of compatible board thicknesses.
Non-destructive knurling device. Excellent knurling design minimize the damage to PCB or dry film and fulfill the best peeling performance.
Mylar quick welding. Adopt hot melt welding device what carrying out to collect Mylar in roll. Compact and save space. Low power welding device what can ramp up and down temperature safely and quickly and ensure the excellent welding quality.
Buffer. Detect the failure of peeling and store failed panel in buffer automatically without interrupt the machine operation.
Residual film inspection: Sensor detection is set up to automatically detect the Mylar status from film lifting to film winding.

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