Microwave Plasma Photoresist Removal Equipment

Apply to 8″/12″ wafer.
2-6 process chambers selectable.
Stable transfer system.
Fully digital control and SECS/GEM compliant.
3 processes mode: microwave, RF or dual source.
Low damage microwave plasma system.
High density microwave plasma can enhance the processes efficiency.
Remote plasma system can reduce the processes temperature and the damage of plasma.

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