De-Warpage OVEN
DUAL TECHNOLOGY PLATFORM
1.馬達加壓式 Motor Precision Press
兩段式壓制 Two-stage pressing mechanism
穩定的線性控制 Stable linear pressure control
高重複性 High repeatability
2.氣壓式 Air Pressure Type
多層壓制結構 Multi-layer pressing structure
上下腔獨立控制 Independent upper/lower chamber control
即時壓力監控 real-time pressure monitor
APPLICATIONS
CoWoS / FOWLP
Panela Level Packaging
AI / HPC Devices
WHY WARPAGE MATTERS
- Bonding failure
- Die shift
- RDL misalignment
- Yield loss in advanced packaging
FEATURE HIGHLIGHTS
- 最佳化熱循環 Optimized thermal circulation
- 均勻的溫度分佈 Uniform temperature distribution
- 可控制的冷卻系統 Controlled cooling system
- 可對應翹曲量 ≤5mm warpage tolerance ≤5mm
TECHNICAL DATA
FEATURE HIGHLIGHTS
- 最佳化熱循環 Optimized thermal circulation
- 均勻的溫度分佈 Uniform temperature distribution
- 可控制的冷卻系統 Controlled cooling system
- 可對應翹曲量 ≤5mm warpage tolerance ≤5mm
TECHNICAL DATA
| 均溫
Temperature Uniformity |
±5(Chamber) |
| 最大加壓能力
Pressure Range |
4.4kg/slot & 6000kg/slot |
| 適用產品尺寸
Applicable product size |
Max $600 ×600 mm |
| 腔室配置
Chamber Configuration |
獨立控制
Dual Zone Independent Control |
| 加熱系統
Heating Type |
電熱 + 熱風循環
Electric + Hot Air Circulation |
| 冷卻系統
Cooling System |
氣冷 + 水冷卻輔助
Water Cooling Assisted |
