Established in 1966, C SUN has been dedicated to advancing light and thermal applications, with expertise in essential process technologies, including lamination, bonding, debonding, thermal curing, and pre-plating surface treatments. By integrating resources from the G2C+ Alliance, C SUN delivers comprehensive process solutions and stands as a leading equipment provider in advanced packaging and PCB substrate manufacturing.

Across equipment categories, including bonding, laminating, peeling, baking, and electroplating pre-treatment, C SUN holds a dominant market share in the Greater China region. With strong global customer trust and recognition, C SUN has become one of the most reliable partners in the industry.

C SUN remains committed to its core business, deepening technical expertise while expanding its global footprint. Our mission is to continuously innovate and tackle the toughest challenges in advanced processes, such as 3D stacking, heterogeneous integration, line-width scaling, and wafer thinning. We deliver exceptional equipment solutions, building trusted partnerships with world-class customers. Together, we co-create and move forward in the semiconductor industry, striving to become a global leader in process equipment.

  • Establishment: September 28, 1966
  • Capital: NT$1.56 Billion
  • Chairman: Morrison Liang
  • Operating Centers: Linkou \ Taichung \ Tainan \ Guangzhou \ Kunshan \ Dongguan \ Bangkok