Wafer-form CBVO

Wafer-form CBVO

SKU:CBVO
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Refer to the catalog

1.Designed for Temporary Bonding process
2.Superior pressure uniformity
3.Max. pressure : 0.5 MPa
4.Max. temperature : 250℃
5.Flexible process capability : Vacuum Baking / Carrier Bonding
6.Real time process status display
7.SECS/GEM compatible

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